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        4寸藍寶石襯底

        2014-09-01




        藍寶石晶片



        Item


        4"

        Unit

         Dimension


        Diameter:


        100 ± 0.15

        mm


        Thickness:


        650 ± 20

        um


        Primary Flat:


        301.0

        mm

        Orientation


        Surface-cut:


        C plane : Tilt 0.2°±0.1° in M axis /

        ~


        Primary Flat:


        A plane : 0° ± 0.15°

        ~

        Flatness


        Bow:


         0 ~ (-10)

        um


        Warp:


        20

        um


        Total Thickness Variation (TTV):


        10

        um


        LTV


        2.5

        um


        Front side Roughness


        0.2

        nm


        Back side Roughness


        0.8-1.2

        um


        Cleanliness


        No particles and fingerprints

        ~


        4.Material Quality


        High-purity mono-crystal Al2O3

        ~

         

        5.Package


        Wafers are packed in cleaned wafer cassettes containing 25 wafers under clean room environment.


        ~

         

        6.Trace Ability


        Wafers shall be traceable with respect to cassette number. The wafer box should be marked with a removable label showing the date, the cassette number and the quantity.


        ~

         

        7.Laser Mark


        Front or Back side


        ~

         

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